Abstract

RAFIZADEH, Masoud; BAHMANI, Majid  and  CHELARAS, Reza T.. New alkaline copper electroplating bath based on an inorganic complexing agent. Port. Electrochim. Acta [online]. 2006, vol.24, n.4, pp.387-392. ISSN 0872-1904.

A new alkaline electrolytic solution based on ammonia for copper electroplating has been investigated. Upon addition of alkaline metal hydroxide solution and ammonia followed by the immediate addition of a strong inorganic acid, a highly exothermic reaction takes place. At optimum solution condition ammonia remains in solution as NH₂ and forms a complexing agent.

Keywords : copper electroplating; alkaline bath; non-cyanide.

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