Servicios Personalizados
Revista
Articulo
Indicadores
- Citado por SciELO
- Accesos
Links relacionados
- Similares en SciELO
Compartir
Portugaliae Electrochimica Acta
versión impresa ISSN 0872-1904
Resumen
RAFIZADEH, Masoud; BAHMANI, Majid y CHELARAS, Reza T.. New alkaline copper electroplating bath based on an inorganic complexing agent. Port. Electrochim. Acta [online]. 2006, vol.24, n.4, pp.387-392. ISSN 0872-1904.
A new alkaline electrolytic solution based on ammonia for copper electroplating has been investigated. Upon addition of alkaline metal hydroxide solution and ammonia followed by the immediate addition of a strong inorganic acid, a highly exothermic reaction takes place. At optimum solution condition ammonia remains in solution as NH2 and forms a complexing agent.
Palabras clave : copper electroplating; alkaline bath; non-cyanide.