New alkaline copper electroplating bath based on an inorganic complexing agent

Masoud Rafizadeh,^a Majid Bahmani,^b,* Reza T. Chelaras^a

^a) Department of Chemistry, University of Tarbiat Moalem, Shahid Mofateh Street, Tehran, Iran

^b)Research Institute of Petroleum Industry, Catalyst Division, P.O. Box: 18745-4163, Pazhooheshgah Blvd. Khairabad, Old Qom Road, Tehran, Iran

 

Received 25 September 2004, accepted October 2006

 

Abstract

A new alkaline electrolytic solution based on ammonia for copper electroplating has been investigated. Upon addition of alkaline metal hydroxide solution and ammonia followed by the immediate addition of a strong inorganic acid, a highly exothermic reaction takes place. At optimum solution condition ammonia remains in solution as NH₂ and forms a complexing agent.

Keywords: copper electroplating, alkaline bath, non-cyanide.

 

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^*Corresponding author. E-mail address: bahmani61@yahoo.com