<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>0872-1904</journal-id>
<journal-title><![CDATA[Portugaliae Electrochimica Acta]]></journal-title>
<abbrev-journal-title><![CDATA[Port. Electrochim. Acta]]></abbrev-journal-title>
<issn>0872-1904</issn>
<publisher>
<publisher-name><![CDATA[Sociedade Portuguesa de Electroquímica]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S0872-19042011000200003</article-id>
<title-group>
<article-title xml:lang="en"><![CDATA[Influence of Operation Parameters on Metal Deposition in Bright Nickel-plating Process]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Sadiku-Agboola]]></surname>
<given-names><![CDATA[O.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Sadiku]]></surname>
<given-names><![CDATA[E.R.]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Ojo]]></surname>
<given-names><![CDATA[O.I.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Akanji]]></surname>
<given-names><![CDATA[O.L.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Biotidara]]></surname>
<given-names><![CDATA[O.F.]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
</contrib-group>
<aff id="A01">
<institution><![CDATA[,Tshwane University of Technology Faculty of Engineering and the Built Environment Department of Chemical Engineering]]></institution>
<addr-line><![CDATA[Pretoria ]]></addr-line>
<country>South Africa</country>
</aff>
<aff id="A02">
<institution><![CDATA[,Tshwane University of Technology Faculty of Engineering and the Built Environment Department of Mechanical Engineering]]></institution>
<addr-line><![CDATA[Pretoria ]]></addr-line>
<country>South Africa</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>00</month>
<year>2011</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>00</month>
<year>2011</year>
</pub-date>
<volume>29</volume>
<numero>2</numero>
<fpage>91</fpage>
<lpage>100</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://scielo.pt/scielo.php?script=sci_arttext&amp;pid=S0872-19042011000200003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://scielo.pt/scielo.php?script=sci_abstract&amp;pid=S0872-19042011000200003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://scielo.pt/scielo.php?script=sci_pdf&amp;pid=S0872-19042011000200003&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="en"><p><![CDATA[Bright nickel deposits were electrolytically applied on steel in the nickel Watts bath. The effect of some operational parameters on metal deposition in bright nickel plating was investigated. The investigation indicated that the weight of bright nickel deposited on metal during the process of electroplating was affected by plating temperature, voltage, current density, plating bath pH and plating time. The study established that the deposition of best bright nickel was obtained at a plating temperature of 56 ºC, current density of 6 A/dm² and plating time of 18 minutes. Brightener is used in applications requiring outstanding appearance with minimum thickness of applied nickel plating. It can also be used for heavy deposit applications because it exhibits unparalleled ductility and low stress. Brightener was used in this study to determine the best nickel plating in the process. Boric acid was added for fixing the bath pH. The compositions of the brightener and nickel solution used are included in the text.]]></p></abstract>
<kwd-group>
<kwd lng="en"><![CDATA[operational parameters]]></kwd>
<kwd lng="en"><![CDATA[current density distribution]]></kwd>
<kwd lng="en"><![CDATA[voltage]]></kwd>
<kwd lng="en"><![CDATA[brightener and nickel deposit]]></kwd>
</kwd-group>
</article-meta>
</front><body><![CDATA[ <p><b>Influence of Operation Parameters on Metal Deposition in Bright Nickel-plating    Process</B><B></B></P>     <p><b>&nbsp;</B></P>     <p><b>O. Sadiku-Agboola,<SUP>1,</SUP></B><a name="top0"></a><a href="#0">*</a>    <b>E.R. Sadiku,<SUP>2</SUP> O.I. Ojo,<SUP>1</SUP> O.L. Akanji,<SUP>1 </SUP>O.F.    Biotidara<SUP>2</SUP></B></P>     <p><i><SUP>1 </SUP>Department of Chemical Engineering, Faculty of Engineering    and the Built Environment, Tshwane University of Technology, Pretoria, South    Africa.</i></P>     <p><i>&nbsp;<SUP>2 </SUP>Department of Mechanical Engineering, Faculty of Engineering    and the Built Environment, Tshwane University of Technology, Pretoria, South    Africa.</i></P>     <p>&nbsp;</P>     <p>DOI: 10.4152/pea.201102091</P>     <p>&nbsp;</P>     <p><b>Abstract</B></P>     <p>Bright nickel deposits were electrolytically applied on steel in the  nickel Watts bath. The effect of some operational parameters on metal deposition  in bright nickel plating was investigated. The investigation indicated that the  weight of bright nickel deposited on metal during the process of electroplating  was affected by plating temperature, voltage, current density, plating bath pH  and plating time. The study established that the deposition of best bright  nickel was obtained at a plating temperature of 56 <SUP>o</SUP>C, current  density of 6 A/dm<SUP>2 </SUP>and plating time of 18 minutes.  Brightener is used  in applications requiring outstanding appearance with minimum thickness of  applied nickel plating. It can also be used for heavy deposit applications  because it exhibits unparalleled ductility and low stress. Brightener was used in this study to determine the best nickel plating  in the process. Boric acid was added for fixing the bath pH.&nbsp; The compositions of the brightener and  nickel solution used are included in the text.</P>     ]]></body>
<body><![CDATA[<p><B>Keywords: </B>operational parameters, current density distribution, voltage,    brightener and nickel deposit.</P>     <p>&nbsp;</P>     <p>Full text only available in PDF format.</P>     <p>Texto completo dispon&iacute;vel apenas em PDF.</p>     <p>&nbsp;</P>       <p><b>References</B></P>     <p>1.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  Q. Xu, A. Telukdarie, H.H. Lou, Y. Huang<i>, Ind. Eng. </I><i>Chem.  Res.</I>  44 (2005) 2156.  10.1021/ie0495067</P>     <p>2.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  E. Binkauskene, <i>Rus. J. Appl.  </I><i>Chem.</I>  75 (2002) 852.  10.1023/A:1020395520503</P>     <p>3.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  R.D. Davis, Nickel, Cobalt and their Alloys. ASM International  Handbook Committe. U.S.A., 2000. p.106-107.</P>     <p>4.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  A.O. Gezerman, B.D. Corbacioglu, <i>Int. J. Chem.</I> 2&nbsp; (2010) 124.</P>     ]]></body>
<body><![CDATA[<p>5.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  L. Chao-qun, L. Xin-hai, W. Zhi-xin, G. Hua-Jun, <i>Transition Nonferrous Metals Soc.  </I><i>China</I>  17 (2007) 1300.</P>     <p>6.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  D. Golodnitsky, N.V. Gudin, G.A. Volyanuk, <i>Journal of the Electrochemical Society</I>  147 (2000) 4156. 10.1149/1.1394034</P>     <p>7.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  P. Spacek, M. AngeManier, A. El Moudni, <i>Int. J. System Sci.</I> 30 (1999) 759.  10.1080/002077299292065</P>     <p>8.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  V.I.  Karavaev, I.L. Korobova, V.  Litovka  Yu,  <i>Rus.  J. Appl. Chem.</I>  79  (2006) 1840.  10.1134/S1070427206110152</P>     <!-- ref --><p>9.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  J. Zhang, <i>J. Mater. Processing  Tech.</I> 123 (2002) 329. 10.1016/S0924-0136(02)00012-2&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=000027&pid=S0872-1904201100020000300001&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --><p>10.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  E. Kukharenka, M.M. Farooqui, L. Grigore, M. Kraft, N. Hollinshead,  <i>J. Micromech. </I><i>Microeng.</I>  13 (2003) S67. 10.1088/0960-1317/13/4/311</P>     <p>11.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  Y.  Kaneko, Y. Hiwatari,&nbsp; K. Ohara, F.  Asa, <i>Molecular Simulation</I> 32 (2006)  1227.  10.1080/08927020601067540</P>     <p>12.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  M.  Vidal, J.M. Amigo, R. Bro, M. Ostra, C. Ubide, <i>Analytical Method</I> 2 (2010) 86.  10.1039/b9ay00158a</P>     <p>13.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  S.  Lambert, <i>Circuit World</I> 32 (2006) 36.  10.1108/03056120610683612</P>     <p>14.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;  R. Ghanem, H. Farag, Y. Etlaweel, M.E. Ossman, <i>Int. J. Chem. Eng. </I><i>Research  </I>1  (2009) 135.</P>     ]]></body>
<body><![CDATA[<p>&nbsp;</P>         <p><a name="0"></a><a href="#top0">*</a> Corresponding author. E-mail address:    <a href="mailto:funmi2406@gmail.com">funmi2406@gmail.com</a></P>     <p>Received 6 October 2010; accepted 27 March 2011</P>      ]]></body><back>
<ref-list>
<ref id="B1">
<label>9</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Zhang]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
</person-group>
<source><![CDATA[J. Mater. Processing Tech.]]></source>
<year>2002</year>
<volume>123</volume>
<page-range>329</page-range></nlm-citation>
</ref>
</ref-list>
</back>
</article>
